H2020-ICT-2018-2 Start date 1 Jan 2019

The WASP project aims at bringing the much-needed step change in flexible and wearable electronics by developing a new industrially driven enabling printing technology for the definition of electronic devices and circuits on paper, a flexible and foldable substrate, which is low cost, disposable, biodegradable, easily obtainable in nature and compatible with high speed roll-to-roll processes.

The proposed technology is based on an environmentally friendly process and addresses the needs for future circular economy, as well as that for cheap, flexible and lightweight, multi-functional electronics.

At the end of the project, a demonstrator will be released, able to sense biometric parameters (i.e., humidity, pH, glucose levels) and to communicate to an external reader, developed on purpose within the WASP activity.