European projects

QUEFORMAL - Quantum Engineering for Machine Learning

H2020-FETOPEN-2018-2019-2020-01 

Start date  1 Jan 2019
End date 31 Dec 2022

website: https://www.queformal.eu/

Coordinator: Giuseppe Iannaccone

 

WASP - Wearable Applications enabled by electronics Systems on Paper

H2020-ICT-2018-2 

Start date 1 Jan 2019
End date 30 June 2022

The WASP project aims at bringing the much-needed step change in flexible and wearable electronics by developing a new industrially driven enabling printing technology for the definition of electronic devices and circuits on paper, a flexible and foldable substrate, which is low cost, disposable, biodegradable, easily obtainable in nature and compatible with high speed roll-to-roll processes.

REACTION

H2020-ECSEL-2017-1-IA-two-stage 

Start date 01/11/2018
End date 30/04/2022

Website: http://www.reaction-ecsel.eu/ 

R3 - PowerUp

ECSEL-2016-2

Start Date November, 1 2017
End Date April 30, 2023

https://www.ecsel.eu/projects/r3-powerup

Smart power ICs are key enabling components for applications in which Europe is playing a leading role: from mid-power automotive, to industrial power, battery management systems for HEV, FEV and electric bikes, domotics, LED lighting for both indoor and outdoor, computer and industrial peripherals.

EUROPEAN PROCESSOR INITIATIVE (EPI)

H2020-SGA-LPMT-2018

Start date:  01 Dec 2018
End date: 30 Nov 2021

The European Processor Initiative (EPI) gets together 23 partners from 10 European countries, with the aim to bring to the market a low power microprocessor.

The EPI SGA1 project will be the first phase of the European Processor Initiative FPA, whose aim is to design and implement a roadmap for a new family of low-power European processors for extreme scale computing, high-performance Big-Data and a range of emerging applications. 

 

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